Combined molded earpiece and support for lightweight headsets
Description
FIG. 1 is a right side perspective view of a combined molded earpiece and support for lightweight headsets showing my new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a bottom plan view thereof; and
FIG. 5 is a right side perspective view thereof on a reduced scale and in operative relationship relative to a lightweight headset which has been partially shown in broken lines for illustrative purposes only.
Referenced Cited
U.S. Patent Documents
2521414 | September 1950 | Schier |
2939923 | June 1960 | Henderson |
D141071 | May 1945 | Hechler |
Patent History
Patent number: D242810
Type: Grant
Filed: Aug 29, 1974
Date of Patent: Dec 21, 1976
Assignee: Rynearson, Incorporated (Fullerton, CA)
Inventor: Frederick L. Rynearson (Yorba Linda, CA)
Primary Examiner: Wallace R. Burke
Assistant Examiner: James M. Gandy
Attorney: Philip M. Hinderstein
Application Number: 5/501,598
Type: Grant
Filed: Aug 29, 1974
Date of Patent: Dec 21, 1976
Assignee: Rynearson, Incorporated (Fullerton, CA)
Inventor: Frederick L. Rynearson (Yorba Linda, CA)
Primary Examiner: Wallace R. Burke
Assistant Examiner: James M. Gandy
Attorney: Philip M. Hinderstein
Application Number: 5/501,598
Classifications
Current U.S. Class:
D26/14H
International Classification: D1403;
International Classification: D1403;