Panel board for integrated circuit packages

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Description

FIG. 1 is a top plan view of one side of a panel board for integrated circuit packages showing my new design, the other side being substantially identical thereto;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a fragmentary, front elevational view thereof, the board being broken away for convenience of illustration;

FIG. 4 is a fragmentary, rear elevational view thereof, the board being broken away for convenience of illustration.

Referenced Cited
U.S. Patent Documents
D235264 June 1975 Murphy
Other references
  • Api/Amp Terminal & Connector Handbook, 1972, p. 551, Standard Series Panels. Electronic Molding Corp. Product Bulletin, FS-18, High Density Nurl-Loc, i.c. Panel.
Patent History
Patent number: D258281
Type: Grant
Filed: Sep 23, 1977
Date of Patent: Feb 17, 1981
Assignee: Electronic Molding Corporation (Woonsocket, RI)
Inventor: James V. Murphy (Warwick, RI)
Primary Examiner: Susan J. Lucas
Attorney: Elliot A. Salter
Application Number: 5/836,246
Classifications
Current U.S. Class: D13/12
International Classification: D1303;