Heat releasing plate for mounting semiconductor components

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Description

FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof; and

FIG. 6 is a sectional view taken on line 6--6 of FIG. 1.

Referenced Cited
U.S. Patent Documents
2949283 August 1960 Smith
3163207 December 1964 Schultz
3180404 April 1965 Nelson et al.
3187812 June 1965 Staver
Patent History
Patent number: D266078
Type: Grant
Filed: May 30, 1980
Date of Patent: Sep 7, 1982
Assignee: Showa Aluminum Kabushiki Kaisha (Osaka)
Inventor: Yoshihiko Asanuma (Oyama)
Primary Examiner: Susan J. Lucas
Law Firm: Armstrong, Nikaido, Marmelstein & Kubovcik
Application Number: 6/154,979
Classifications
Current U.S. Class: D13/23
International Classification: D1303;