Soldering device

Latest The Cooper Group Deutschland GmbH Patents:

Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a control housing for a soldering device, showing my new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a perspective view of a second embodiment of a control housing for a soldering device;

FIG. 7 is an elevational view of the front panel of the second embodiment; and

FIG. 8 is an elevational view of the front panel of the first embodiment.

Referenced Cited
U.S. Patent Documents
D268642 April 19, 1983 Fielder
Other references
  • Therm-O-Trac Soldering Station Flyer 1002.
Patent History
Patent number: D274882
Type: Grant
Filed: Nov 13, 1981
Date of Patent: Jul 31, 1984
Assignee: The Cooper Group Deutschland GmbH (Besighaim)
Inventor: Gunther Rittmann (Lochgau)
Primary Examiner: Catherine E. Kemper
Law Firm: Mason, Fenwick & Lawrence
Application Number: 6/321,316
Classifications
Current U.S. Class: D 8/30; D 8/71