Readily disassembled instrument housing
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FIG. 1 is a top plan view of a readily disassembled instrument housing showing my new design;
FIG. 2 is a side elevational view of the instrument housing shown in FIG. 1;
FIG. 3 is a bottom plan view of the instrument housing shown in FIGS. 1-2;
FIG. 4 is an end view of the instrument housing shown in FIGS. 1-3;
FIG. 5 is a cross-sectional view taken through FIG. 1 along the line 5--5;
FIG. 6 is a side elevational view of a readily disassembled instrument housing showing a second embodiment of my new design;
FIG. 7 is a top plan view of the second embodiment;
FIG. 8 is a longitudinal cross-sectional view thereof; and
FIG. 9 is a side elevational view of a readily disassembled instrument housing showing a third embodiment of my new design, the top plan view being the same as FIG. 1.
D212784 | November 1968 | Yoshida |
D226196 | January 1973 | Liljenwall |
D226197 | January 1973 | Liljenwall |
D233799 | November 1974 | Finkel |
D248595 | July 18, 1978 | Beitler et al. |
Type: Grant
Filed: May 10, 1982
Date of Patent: Dec 25, 1984
Assignee: LaFrance Corporation (Philadelphia, PA)
Inventor: Peter A. Peroni (Pottstown, PA)
Primary Examiner: Louis S. Zarfas
Law Firm: Connolly and Hutz
Application Number: 6/376,621