Housing for interface module


FIG. 1 is a top view of the housing for interface module, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a side view thereof;

FIG. 4 is a perspective view thereof;

FIG. 5 is a view opposite that shown in FIGS. 3 and 4; and

FIG. 6 is a rear view thereof.

Referenced Cited
U.S. Patent Documents
D220764 May 1971 Ortega et al.
D246368 November 15, 1977 Barnich et al.
4090091 May 16, 1978 Brown et al.
4217624 August 12, 1980 Tuck
Other references
  • Computer Design, 11-1980, p. 84, Bizcomp intelligent modem 1022.
Patent History
Patent number: D285926
Type: Grant
Filed: Dec 14, 1983
Date of Patent: Sep 30, 1986
Assignee: Rockwell International Corp. (El Segundo, CA)
Inventors: Henry J. Kies (Darien, IL), William P. Loris (Bloomingdale, IL)
Primary Examiner: Susan J. Lucas
Attorneys: Carmen B. Patti, V. Lawrence Sewell, H. Fredrick Hamann
Application Number: 6/561,383
Current U.S. Class: D14/114; D13/41