Housing for interface module
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Description
FIG. 1 is a top view of the housing for interface module, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a side view thereof;
FIG. 4 is a perspective view thereof;
FIG. 5 is a view opposite that shown in FIGS. 3 and 4; and
FIG. 6 is a rear view thereof.
Referenced Cited
Patent History
Patent number: D285926
Type: Grant
Filed: Dec 14, 1983
Date of Patent: Sep 30, 1986
Assignee: Rockwell International Corp. (El Segundo, CA)
Inventors: Henry J. Kies (Darien, IL), William P. Loris (Bloomingdale, IL)
Primary Examiner: Susan J. Lucas
Attorneys: Carmen B. Patti, V. Lawrence Sewell, H. Fredrick Hamann
Application Number: 6/561,383
Type: Grant
Filed: Dec 14, 1983
Date of Patent: Sep 30, 1986
Assignee: Rockwell International Corp. (El Segundo, CA)
Inventors: Henry J. Kies (Darien, IL), William P. Loris (Bloomingdale, IL)
Primary Examiner: Susan J. Lucas
Attorneys: Carmen B. Patti, V. Lawrence Sewell, H. Fredrick Hamann
Application Number: 6/561,383
Classifications
Current U.S. Class:
D14/114;
D13/41