Package for earphone

Description

FIG. 1 is a front elevation of a package for earphone showing my new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a left-side elevation thereof;

FIG. 4 is a right-side elevation thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a sectional elevation taken along line 7--7 of FIG. 1; and

FIG. 8 is a sectional elevation taken along line 8--8 of FIG. 1.