Modular jack patch block

- The Siemon Company
Description

FIG. 1 is a bottom plan view of a modular jack patch block showing a first embodiment of my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a front end elevation view thereof;

FIG. 6 is a rear end elevation view thereof;

FIG. 7 is a bottom plan view of a modular jack patch block showing a second embodiment of my new design;

FIG. 8 is a top plan view thereof;

FIG. 9 is a right side elevation view thereof;

FIG. 10 is a left side elevation view thereof;

FIG. 11 is a front end elevation view thereof;

FIG. 12 is a rear end elevation view thereof;

FIG. 13 is a bottom plan view of a modular jack patch block showing a third embodiment of my new design;

FIG. 14 is a top plan view thereof;

FIG. 15 is a right side elevation view thereof;

FIG. 16 is a left side elevation view thereof;

FIG. 17 is a front end elevation view thereof;

FIG. 18 is a rear end elevation view thereof;

FIG. 19 is a bottom plan view of a modular jack patch block showing a fourth embodiment of my new design;

FIG. 20 is a top plan view thereof;

FIG. 21 is a right elevation view thereof;

FIG. 22 is a left side elevation view thereof;

FIG. 23 is a front end elevation view thereof;

FIG. 24 is a rear end elevation view thereof;

FIG. 25 is a bottom plan view of a modular jack patch block showing a fifth embodiment of my new design;

FIG. 26 is a top plan view thereof;

FIG. 27 is a right side elevation view thereof;

FIG. 28 is a left side elevation view thereof;

FIG. 29 is a front end elevation view thereof;

FIG. 30 is a rear end elevation view thereof;

FIG. 31 is a bottom plan view of a modular jack patch block showing a sixth embodiment of my new design;

FIG. 32 is a top plan view thereof;

FIG. 33 is a right side elevation view thereof;

FIG. 34 is a left side elevation view thereof;

FIG. 35 is a front end elevation view thereof;

FIG. 36 is a rear end elevation view thereof;

FIG. 37 is a bottom plan view of a modular jack patch block showing a seventh embodiment of my new design;

FIG. 38 is a top plan view thereof;

FIG. 39 is a right side elevation view thereof;

FIG. 40 is a left side elevation view thereof;

FIG. 41 is a front end elevation view thereof;

FIG. 42 is a rear end elevation view thereof;

FIG. 43 is a bottom plan view of a modular jack patch block showing an eighth embodiment of my new design;

FIG. 44 is a top plan view thereof;

FIG. 45 is a right elevation view thereof;

FIG. 46 is a left elevation view thereof;

FIG. 47 is a front end elevation view thereof;

FIG. 48 is a rear end elevation view thereof;

The rear surface of the top panel which would normally be seen through the apertures in the bottom surface is omitted from FIGS. 1, 7, 13, 19, 25, 31, 37 and 43 for clarity of disclosure.

Referenced Cited
U.S. Patent Documents
D276426 November 20, 1984 DeLuca et al.
D297232 August 16, 1988 Gazzo
4669799 June 2, 1987 Vachhani et al.
Other references
  • Burnoy Electronic Products Catalog, p. 43, Modular Adapter.
Patent History
Patent number: D317297
Type: Grant
Filed: Dec 28, 1988
Date of Patent: Jun 4, 1991
Assignee: The Siemon Company (Watertown, CT)
Inventor: Brian E. Reed (New Hartford, CT)
Primary Examiner: Susan J. Lucas
Law Firm: Fishman, Dionne & Cantor
Application Number: 7/291,432