Package for a headphone

- Sony Corporation
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Description

FIG. 1 is a top, front and right-side perspective view of a package for a headphone, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D291064 July 28, 1987 Haber et al.
D321323 November 5, 1991 Nakamura
D341777 November 30, 1993 Sheu
4319684 March 16, 1982 Backman et al.
4781289 November 1, 1988 Perkins
4901858 February 20, 1990 Anderson
Other references
  • Modern Packaging, 1978, p. 300, as shown. Hardware Age, Sep. 1984, p. 60 as shown.
Patent History
Patent number: D348391
Type: Grant
Filed: Mar 4, 1993
Date of Patent: Jul 5, 1994
Assignee: Sony Corporation (Tokyo)
Inventors: Toru Ichikawa (Yokohama), Yuko Wada (Kawasaki), Yuko Suzuki (Fujisawa), Ellen Tave (Haworth, NJ), Rosalin Yin (Riverdale, NY), Yoshie Nagasaka (Tokyo)
Primary Examiner: Prabhakar G. Deshmukh
Attorneys: Lewis H. Eslinger, Jay H. Maioli
Application Number: 0/5,419
Classifications
Current U.S. Class: D/9415