Embossed car package production system
Latest Dynetics Engineering Corporation Patents:
- Card mailer system and method of preparing card packages for mailing
- Card package production system card with insertion prevention and method
- Card package production system with adhesive card attachment station and method
- Card package production system with a multireader card track and method
- Card package production system with card package stacker and method
Description
FIG. 1 is a perspective view of the preferred embodiment of the embossed card package production system of the present invention;
FIG. 2 is a front side view of the embossed card package production system of FIG. 1;
FIG. 3 is a plan view of the embossed card package production system of FIG. 1;
FIG. 4 is a left side view of the embossed card package production system of FIG. 1;
FIG. 5 is a right side view of the embossed card package production system of FIG. 1; and,
FIG. 6 is a back side view of the embossed card package production system of FIG. 1.
Referenced Cited
Patent History
Patent number: D349505
Type: Grant
Filed: Mar 24, 1993
Date of Patent: Aug 9, 1994
Assignee: Dynetics Engineering Corporation (Lincolnshire, IL)
Inventors: Jeffery L. Hill (Mundelein, IL), Gregory S. Hill (Lake Zurich, IL), James W. Schreiber (Littleton, CO), James P. Knoll (Englewood, CO)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Antoine D. Davis
Law Firm: Potthast & Ring
Application Number: 0/6,267
Type: Grant
Filed: Mar 24, 1993
Date of Patent: Aug 9, 1994
Assignee: Dynetics Engineering Corporation (Lincolnshire, IL)
Inventors: Jeffery L. Hill (Mundelein, IL), Gregory S. Hill (Lake Zurich, IL), James W. Schreiber (Littleton, CO), James P. Knoll (Englewood, CO)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Antoine D. Davis
Law Firm: Potthast & Ring
Application Number: 0/6,267
Classifications
Current U.S. Class:
Packaging Or Wrapping (D15/145)