Package for a wafer for the welding and/or cutting of plastic tubes

- Denco, Inc.
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Description

FIG. 1 is a front elevational view of a package for a wafer for the welding and/or cutting of plastic tubes in accordance with this invention shown in the enclosed condition;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof with the right side being a mirror image;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a front elevational view of the package in an opened condition;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a perspective view thereof.

Referenced Cited
U.S. Patent Documents
D339063 September 7, 1993 Simon
2351223 June 1944 Neivert
3373866 March 1968 Will
4015708 April 5, 1977 Kelm
4016973 April 12, 1977 Blake
4333565 June 8, 1982 Woods
4570797 February 18, 1986 Weinman
5085318 February 4, 1992 Leverick
Other references
  • Modern Packaging, 1958, p. 340, as circled. Packaging, 1959, p. 59, as circled.
Patent History
Patent number: D355848
Type: Grant
Filed: Jan 18, 1994
Date of Patent: Feb 28, 1995
Assignee: Denco, Inc. (Wilmington, DE)
Inventors: Ivars V. Ivansons (Newark, DE), Valdis Ivansons (Wilmington, DE), Dudley W. C. Spencer (Wilmington, DE)
Primary Examiner: Prabhakar G. Deshmukh
Law Firm: Connolly & Hutz
Application Number: 0/17,601
Classifications
Current U.S. Class: D/9415; D/9346