Wafer for the welding and/or cutting of plastic tubes

- Denco, Inc.
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Description

FIG. 1 is a left side elevational view of a wafer for the welding and/or cutting of plastic tubes in accordance with this invention with the right side elevational view being a mirror image thereof;

FIG. 2 is a top plan view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a perspective view thereof.

Referenced Cited
U.S. Patent Documents
3193432 July 1965 Baines
4897138 January 30, 1990 Shaposka et al.
5158630 October 27, 1992 Shaposka et al.
5209800 May 11, 1993 Spencer et al.
5244522 September 14, 1993 Spencer et al.
Patent History
Patent number: D357926
Type: Grant
Filed: Jan 21, 1994
Date of Patent: May 2, 1995
Assignee: Denco, Inc. (Wilmington, DE)
Inventors: Ivars V. Ivansons (Newark, DE), Vadlis Ivansons (Wilmington, DE), Dudley W. C. Spencer (Wilmington, DE)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Antoine D. Davis
Law Firm: Connolly & Hutz
Application Number: 0/17,685
Classifications
Current U.S. Class: Cutting Tool, E.g., Drill Bit, Etc. (D15/139)