Front panel for enclosing electronic circuit packs

- Motorola, Inc.
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Description

FIG. 1 is a front, top, and right side perspective view of a front panel for enclosing electronic circuit packs showing our new design;

FIG. 2 is a left side elevational view thereof; and,

FIG. 3 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D190233 May 1961 Spadaro
D308679 June 19, 1990 Reshanov
D312611 December 4, 1990 Watson et al.
2620080 December 1952 Tomlin
3058020 October 1962 Balan
3233071 February 1966 Buzzell
Patent History
Patent number: D366246
Type: Grant
Filed: Feb 24, 1994
Date of Patent: Jan 16, 1996
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventors: Robert F. Simek (Lakewood, IL), Thomas J. McClaughry (Hoffman Estates, IL)
Primary Examiner: A. Hugo Word
Application Number: 0/19,158