Stampless envelope

- E-Stamp Corporation
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Description

FIG. 1 is a front elevational view of a stampless envelope showing my new design, the broken lines are for illustrative purposes only, forming no part of the claimed design; and,

FIG. 2 is a rear elevational view thereof.

It is understood that the sides of the envelope are of no substantial thickness.

Referenced Cited
U.S. Patent Documents
2794590 June 1957 Sills, Jr.
3221980 December 1965 Mercur
3380648 April 1968 Lyman
4245775 January 20, 1981 Conn
4597591 July 1, 1986 Gendron et al.
4938414 July 3, 1990 Lippert
Patent History
Patent number: D384098
Type: Grant
Filed: Aug 5, 1996
Date of Patent: Sep 23, 1997
Assignee: E-Stamp Corporation (Houston, TX)
Inventor: Salim G. Kara (Houston, TX)
Primary Examiner: Susan J. Lucas
Assistant Examiner: Pam Burgess
Law Firm: Fulbright & Jaworski L.L.P.
Application Number: 0/57,914
Classifications
Current U.S. Class: Envelope (D19/3)
International Classification: 1901;