Housing for electronic components

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Description

FIG. 1 is a perspective view of a housing for electronic components showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Referenced Cited
U.S. Patent Documents
D304193 October 24, 1989 Lotz
D305225 December 26, 1989 Komatsu
D318266 July 16, 1991 Matsuzaki
D322604 December 24, 1991 Komatsu
D332598 January 19, 1993 Kikuta et al.
D334921 April 20, 1993 Basara et al.
D373770 September 17, 1996 James et al.
D375295 November 5, 1996 Derocher et al.
D375938 November 26, 1996 Muller et al.
4812004 March 14, 1989 Biederstedt et al.
5285515 February 8, 1994 Milanowski et al.
5432682 July 11, 1995 Giehl
5546282 August 13, 1996 Hill et al.
Patent History
Patent number: D391263
Type: Grant
Filed: May 2, 1996
Date of Patent: Feb 24, 1998
Assignee: Next Level Communications (Rohnert Park, CA)
Inventors: Russell L. Tucker (San Ramon, CA), Mark S. McCall (Santa Rosa, CA), Bernabe R. Lovina (Benecia, CA)
Primary Examiner: Jeffrey Asch
Law Firm: Skjerven, Morrill, MacPherson, Franklin & Friel
Application Number: 0/59,667
Classifications
Current U.S. Class: Telephone Equipment (D14/240); Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1403;