Roller for a wire saw for semiconductors
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Description
FIG. 1 is a front elevational view of a roller for a wire saw for semiconductors, the rear elevational view being a mirror image of FIG. 1;
FIG. 2 is a top plan view thereof, the bottom plan view being identical with FIG. 2;
FIG. 3 is a right side elevational view thereof, the left side elevational view being identical with FIG. 3;
FIG. 4 is a perspective view thereof; and,
FIG. 5 is a referential view showing location of the present article in a wire saw for semiconductors.
Referenced Cited
Patent History
Patent number: D401249
Type: Grant
Filed: Aug 12, 1997
Date of Patent: Nov 17, 1998
Assignee: Nippei Toyama Corporation (Tokyo)
Inventor: Akio Kawakita (Yokohama)
Primary Examiner: Antoine Duval Davis
Law Firm: Trask, Britt & Rossa
Application Number: 0/75,089
Type: Grant
Filed: Aug 12, 1997
Date of Patent: Nov 17, 1998
Assignee: Nippei Toyama Corporation (Tokyo)
Inventor: Akio Kawakita (Yokohama)
Primary Examiner: Antoine Duval Davis
Law Firm: Trask, Britt & Rossa
Application Number: 0/75,089
Classifications
Current U.S. Class:
Sawing (includes Element) (D15/133);
Element Or Attachment (D15/138)
International Classification: 1509;
International Classification: 1509;