Roller for a wire saw for semiconductors

- Nippei Toyama Corporation
Description

FIG. 1 is a front elevational view of a roller for a wire saw for semiconductors, the rear elevational view being a mirror image of FIG. 1;

FIG. 2 is a top plan view thereof, the bottom plan view being identical with FIG. 2;

FIG. 3 is a right side elevational view thereof, the left side elevational view being identical with FIG. 3;

FIG. 4 is a perspective view thereof; and,

FIG. 5 is a referential view showing location of the present article in a wire saw for semiconductors.

Referenced Cited
U.S. Patent Documents
D369361 April 30, 1996 Satake
5715807 February 10, 1998 Toyama et al.
Patent History
Patent number: D401249
Type: Grant
Filed: Aug 12, 1997
Date of Patent: Nov 17, 1998
Assignee: Nippei Toyama Corporation (Tokyo)
Inventor: Akio Kawakita (Yokohama)
Primary Examiner: Antoine Duval Davis
Law Firm: Trask, Britt & Rossa
Application Number: 0/75,089
Classifications
Current U.S. Class: Sawing (includes Element) (D15/133); Element Or Attachment (D15/138)
International Classification: 1509;