Housing for electronic components

- Next Level Communications
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Description

FIG. 1 is a perspective front elevation view of a housing for electronic components;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.

Referenced Cited
U.S. Patent Documents
D330888 November 10, 1992 Worley
D350533 September 13, 1994 Grosskurth et al.
D353800 December 27, 1994 Lewis et al.
D368068 March 19, 1996 Alden et al.
D389840 January 27, 1998 Tucker et al.
D391623 February 1998 Tucker et al.
4812004 March 14, 1989 Biederstedt et al.
5285515 February 8, 1994 Milanowski et al.
5432682 July 11, 1995 Giehl
5546282 August 13, 1996 Hill et al.
Patent History
Patent number: D404018
Type: Grant
Filed: May 30, 1997
Date of Patent: Jan 12, 1999
Assignee: Next Level Communications (Rohnert Park, CA)
Inventors: Russell L. Tucker (Sebastopol, CA), Mark S. McCall (Santa Rosa, CA), Bernabe R. Lovina (Benecia, CA)
Primary Examiner: Brian N. Vinson
Attorney: Skjerven, Morrill, MacPherson, Franklin & Friel LLP
Application Number: 0/71,581
Classifications
Current U.S. Class: Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1399;