Electrical housing with module

- Echelon Corporation
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Description

FIG. 1 is a top, rear, and right side perspective view of the first embodiment of an electrical housing with module showing our new design, the broken-line disclosure being for illustrative purposes only and forming no part of the claimed design;

FIG. 2 is an enlarged left side elevational view thereof;

FIG. 3 is an enlarged rear elevational view thereof;

FIG. 4 is an enlarged front elevational view thereof;

FIG. 5 is an enlarged top plan view thereof, the bottom being identical in appearance; and,

FIG. 6 is an elarged front elevational view of the second embodiment thereof, the only difference residing in the appearance of this elevation.

Referenced Cited
U.S. Patent Documents
D297136 August 9, 1988 Collins et al.
D360620 July 25, 1995 Gehrs et al.
D362255 September 12, 1995 White
D373771 September 17, 1996 Messelhi
D390235 February 3, 1998 Tucker et al.
Patent History
Patent number: D404721
Type: Grant
Filed: Aug 7, 1997
Date of Patent: Jan 26, 1999
Assignee: Echelon Corporation (Palo Alto, CA)
Inventors: Michael Reid Tennefoss (Portola Valley, CA), James Marcus Stewart (San Jose, CA), Milton Thomas Tormey (Los Altos, CA)
Primary Examiner: Brian N. Vinson
Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 0/74,664
Classifications
Current U.S. Class: Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1301;