Housing adapted to releasably receive a device bay electronic component
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Description
FIG. 1 is a front elevation view of the housing showing our new invention;
FIG. 2 is a left elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a back elevation thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view of the preferred embodiment thereof showing the device closed; and,
FIG. 8 is a perspective view of the preferred embodiment thereof showing the device open.
The broken-line disclosure in the drawings is for illustrative purposes only and forms no part of the claimed design.
Referenced Cited
Patent History
Patent number: D424027
Type: Grant
Filed: Nov 13, 1998
Date of Patent: May 2, 2000
Assignee: Palo Alto Design Group (Palo Alto, CA)
Inventors: Thomas Mamoru Shoda (Campbell, CA), Livius Dumitru Chebeleu (Cupertino, CA)
Primary Examiner: Brian N. Vinson
Law Firm: Haverstock & Owens LLP
Application Number: 0/96,511
Type: Grant
Filed: Nov 13, 1998
Date of Patent: May 2, 2000
Assignee: Palo Alto Design Group (Palo Alto, CA)
Inventors: Thomas Mamoru Shoda (Campbell, CA), Livius Dumitru Chebeleu (Cupertino, CA)
Primary Examiner: Brian N. Vinson
Law Firm: Haverstock & Owens LLP
Application Number: 0/96,511
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1303;
International Classification: 1303;