Wire bundling support

- Shinagawa Shoko Co., Ltd.
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Description

FIG. 1 is a front, top and left side perspective view of a wire bundling support showing my new design;

FIG. 2 is a front evevational view thereof, the rear elevational view being identical;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a left side view thereof, the right side view being a mirror image.

Referenced Cited
U.S. Patent Documents
3516631 June 1970 Santucci
4609171 September 2, 1986 Matsui
Patent History
Patent number: D425779
Type: Grant
Filed: Jun 29, 1999
Date of Patent: May 30, 2000
Assignee: Shinagawa Shoko Co., Ltd. (Tokyo)
Inventor: Toshinobu Nakamura (Tokyo)
Primary Examiner: Holly Baynham
Law Firm: Frishauf, Holtz, Goodman, Langer & Chick, P.C.
Application Number: 0/107,184
Classifications
Current U.S. Class: D/8356
International Classification: 0805;