Electronic instrument package
Latest Red Chip Company, Ltd. Patents:
FIG. 1 is a perspective view of an electronic instrument package.
FIG. 2 is a top plan view of the electronic instrument package of FIG. 1.
FIG. 3 is a bottom plan view of the electronic instrument package of FIG. 1.
FIG. 4 is a rear elevation view of the electronic instrument package of FIG. 1.
FIG. 5 is a front elevation view of the electronic instrument package of FIG. 1.
FIG. 6 is a left side elevation view of the electronic instrument package of FIG. 1; and,
FIG. 7 is a right elevation view of the electronic instrument package of FIG. 1.
The broken lines shown in FIGS. 1-7 are illustrative of environmental features only and form no part of the claimed design.
Claims
The ornamental design for an electronic instrument package, as shown and described.
D236212 | August 1975 | Beigel et al. |
D244215 | May 3, 1977 | Ross |
D324048 | February 18, 1992 | Tanaka |
D401963 | December 1, 1998 | Schneider et al. |
5475214 | December 12, 1995 | DeFranco et al. |
5700966 | December 23, 1997 | LaMarra |
- Musician's Friend, Catalog, Spring 2000, Medford, Oregon, front cover, back cover, pp. 22 and 49.
- “J-Station On Line Information Center”, Johnson Amps., Internet URL www.johnson-amp.com/jstation.htm, p. 1 of 2.
- “Line 6 Product Showroom, POD 2.0”, Internet URL www.line6.com/Main/Products/productgroups/ProductDetails.cfm?ProductID=7, p. 1 of 2.
Type: Grant
Filed: May 26, 2000
Date of Patent: Jul 3, 2001
Assignee: Red Chip Company, Ltd. (Tortola)
Inventor: Ulrich Behringer (Hong Kong)
Primary Examiner: Adir Aronovich
Attorney, Agent or Law Firm: Stoel Rives LLP
Application Number: 29/123,940
International Classification: 1799;