Electronic instrument package

- Red Chip Company, Ltd.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of an electronic instrument package.

FIG. 2 is a top plan view of the electronic instrument package of FIG. 1.

FIG. 3 is a bottom plan view of the electronic instrument package of FIG. 1.

FIG. 4 is a rear elevation view of the electronic instrument package of FIG. 1.

FIG. 5 is a front elevation view of the electronic instrument package of FIG. 1.

FIG. 6 is a left side elevation view of the electronic instrument package of FIG. 1; and,

FIG. 7 is a right elevation view of the electronic instrument package of FIG. 1.

The broken lines shown in FIGS. 1-7 are illustrative of environmental features only and form no part of the claimed design.

Claims

The ornamental design for an electronic instrument package, as shown and described.

Referenced Cited
U.S. Patent Documents
D236212 August 1975 Beigel et al.
D244215 May 3, 1977 Ross
D324048 February 18, 1992 Tanaka
D401963 December 1, 1998 Schneider et al.
5475214 December 12, 1995 DeFranco et al.
5700966 December 23, 1997 LaMarra
Other references
  • Musician's Friend, Catalog, Spring 2000, Medford, Oregon, front cover, back cover, pp. 22 and 49.
  • “J-Station On Line Information Center”, Johnson Amps., Internet URL www.johnson-amp.com/jstation.htm, p. 1 of 2.
  • “Line 6 Product Showroom, POD 2.0”, Internet URL www.line6.com/Main/Products/productgroups/ProductDetails.cfm?ProductID=7, p. 1 of 2.
Patent History
Patent number: D444493
Type: Grant
Filed: May 26, 2000
Date of Patent: Jul 3, 2001
Assignee: Red Chip Company, Ltd. (Tortola)
Inventor: Ulrich Behringer (Hong Kong)
Primary Examiner: Adir Aronovich
Attorney, Agent or Law Firm: Stoel Rives LLP
Application Number: 29/123,940
Classifications
Current U.S. Class: Miscellaneous (D17/99); Element Or Attachment (11) (D14/217)
International Classification: 1799;