Modular jack housing

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Description

FIG. 1 is a front, top and right side perspective view of a modular jack housing showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a modular jack housing, as shown.

Referenced Cited
U.S. Patent Documents
D303109 August 29, 1989 Matsuzaki et al.
D399827 October 20, 1998 Gaffney
5876240 March 2, 1999 Derstine et al.
5885100 March 23, 1999 Talend et al.
5934940 August 10, 1999 Maranto et al.
5961350 October 5, 1999 Shiu
5980320 November 9, 1999 Slack et al.
Patent History
Patent number: D444771
Type: Grant
Filed: Mar 22, 2000
Date of Patent: Jul 10, 2001
Assignee: Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien)
Inventor: Kun-Tsan Wu (Tu-Chen)
Primary Examiner: Joel Sincavage
Attorney, Agent or Law Firm: Wei Te Chung
Application Number: 29/120,615
Classifications
Current U.S. Class: Linear Array Of Identical Repeating Ports Or Contacts (i.e., In-line Array) (D13/147)
International Classification: 1303;