Retractable headset housing
Latest FSL Electronics Pty Ltd. Patents:
Description
FIG. 1 is an isometric view of the retractable headset housing showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in FIG. 1, showing the earphone/headset and the coiled phone jack cord are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a retractable headset housing, as shown and described.
Referenced Cited
Patent History
Patent number: D457516
Type: Grant
Filed: Jan 23, 2001
Date of Patent: May 21, 2002
Assignee: FSL Electronics Pty Ltd. (Cranbourne)
Inventors: Paramjit Kohli (Cranbourne), Seok-Ki Kim (Goyang)
Primary Examiner: Nanda Bondade
Attorney, Agent or Law Firm: Blumenfeld, Kaplan & Sandweiss, P.C.
Application Number: 29/136,016
Type: Grant
Filed: Jan 23, 2001
Date of Patent: May 21, 2002
Assignee: FSL Electronics Pty Ltd. (Cranbourne)
Inventors: Paramjit Kohli (Cranbourne), Seok-Ki Kim (Goyang)
Primary Examiner: Nanda Bondade
Attorney, Agent or Law Firm: Blumenfeld, Kaplan & Sandweiss, P.C.
Application Number: 29/136,016
Classifications
Current U.S. Class:
Support (e.g., Mounting Panel, Basket, Frame, Etc.) (D14/224);
D3/218
International Classification: 1401;
International Classification: 1401;