Retractable headset housing

- FSL Electronics Pty Ltd.
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Description

FIG. 1 is an isometric view of the retractable headset housing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines in FIG. 1, showing the earphone/headset and the coiled phone jack cord are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a retractable headset housing, as shown and described.

Referenced Cited
U.S. Patent Documents
3984645 October 5, 1976 Kresch
4942617 July 17, 1990 Boylan
D314964 February 26, 1991 Chung
5161250 November 3, 1992 Ianna et al.
D363461 October 24, 1995 Duckman et al.
D368581 April 9, 1996 Cincotta
Patent History
Patent number: D457516
Type: Grant
Filed: Jan 23, 2001
Date of Patent: May 21, 2002
Assignee: FSL Electronics Pty Ltd. (Cranbourne)
Inventors: Paramjit Kohli (Cranbourne), Seok-Ki Kim (Goyang)
Primary Examiner: Nanda Bondade
Attorney, Agent or Law Firm: Blumenfeld, Kaplan & Sandweiss, P.C.
Application Number: 29/136,016
Classifications
Current U.S. Class: Support (e.g., Mounting Panel, Basket, Frame, Etc.) (D14/224); D3/218
International Classification: 1401;