Shrink wrapped carton for electronic component

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Description

FIG. 1 is a perspective view of a shrink-wrapped package for an electronic component showing my new design.

FIG. 2 is a front view of the package shown in FIG. 1.

FIG. 3 is a rear view of the package shown in FIG. 1.

FIG. 4 is a left side view of the package shown in FIG. 1.

FIG. 5 is a right side view of the package shown in FIG. 1.

FIG. 6 is a top view of the package shown in FIG. 1; and,

FIG. 7 is a bottom view of the package shown in FIG. 1.

Claims

The ornamental design for a shrink wrapped carton for electronic component, as shown.

Referenced Cited
U.S. Patent Documents
4355758 October 26, 1982 Lavery
4450959 May 29, 1984 Sommer
4605007 August 12, 1986 Heraly
5184725 February 9, 1993 Reinheimer et al.
D420906 February 22, 2000 Nash et al.
D425415 May 23, 2000 Kumakura et al.
D434648 December 5, 2000 Li et al.
Patent History
Patent number: D462262
Type: Grant
Filed: Nov 21, 2000
Date of Patent: Sep 3, 2002
Assignee: Koninklijke Philips Electronics, N.V. (Eindhoven)
Inventor: David P. Leja (Dodgeville, WI)
Primary Examiner: Prabhakar Deshmukh
Attorney, Agent or Law Firm: Robert J. Kraus
Application Number: 29/133,052
Classifications
Current U.S. Class: D9/415
International Classification: 0903;