Wiring line bundling/fixing device

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Description

FIG. 1 is a front, top and right side perspective view of a wiring line bundling/fixing device, showing my new design;

FIG. 2 is a front elevational view thereof, the rear, right and left side views being identical to the front view;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a cross-sectional view taken along line 5—5 in FIG. 3; and,

FIG. 6 is a reference view showing the state of use of the device shown in FIG. 1.

The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a wiring line bundling/fixing device, as shown and described.

Referenced Cited
U.S. Patent Documents
3381635 May 1968 Pforr
D316511 April 30, 1991 White, Jr.
5816554 October 6, 1998 McCracken
D401498 November 24, 1998 Caveney
D435430 December 26, 2000 Valentz et al.
6206613 March 27, 2001 Elkins
Other references
  • Catalog of Cable Ties & Wiring Accessories (U.S. version), Panduit Corp., Tinley Park, Illinois, USA, 1998, pp. 80 and 81.
  • Catalog of Bundling/Fixing Devices (Japanese version), Panduit Corp., Tinley Park, Illinois, USA, Apr. 2000, p. 16.
Patent History
Patent number: D465722
Type: Grant
Filed: Mar 5, 2001
Date of Patent: Nov 19, 2002
Inventor: Hiroyuki Shijyo (Tokyo)
Primary Examiner: Doris V. Coles
Assistant Examiner: Elizabeth A. Albert
Attorney, Agent or Law Firm: Frishauf, Holtz, Goodman & Chick, P.C.
Application Number: 29/138,049
Classifications
Current U.S. Class: D8/356
International Classification: 0805;