Earphone headset

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Description

FIG. 1 is a perspective view of an earphone headset of the design as seen from the front and one side with the boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 2 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 3 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 4 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 5 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 6 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 7 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 8 is a perspective view of a modified embodiment of the earphone headset of the design as seen from the front and one side with boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 9 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 10 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 11 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 12 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 13 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention; and,

FIG. 14 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention.

Claims

We claim the ornamental design for an earphone headset, as shown and described.

Referenced Cited

U.S. Patent Documents

5117464 May 26, 1992 Jones et al.
5359157 October 25, 1994 Liu
D358391 May 16, 1995 Isono
D366486 January 23, 1996 Runquist et al.
D375313 November 5, 1996 Jensen et al.
D394437 May 19, 1998 Landreth et al.
5793865 August 11, 1998 Leifer
5793878 August 11, 1998 Chang
D404734 January 26, 1999 Andrea
D423012 April 18, 2000 Yasutomi
D443870 June 19, 2001 Carpenter et al.
D448751 October 2, 2001 Pham et al.
D449038 October 9, 2001 Andreini et al.
D449289 October 16, 2001 Weikel et al.
D458246 June 4, 2002 Davies et al.
D458248 June 4, 2002 Davies et al.

Patent History

Patent number: D468723
Type: Grant
Filed: Jan 24, 2002
Date of Patent: Jan 14, 2003
Assignee: Telex Communications, Inc. (Burnsville, MN)
Inventors: Hoa Pham (Woodbury, MN), Jason Lardy (Minneapolis, MN)
Primary Examiner: Paula A. Mortimer
Attorney, Agent or Law Firm: Fredrikson & Byron, P.A.
Application Number: 29/154,626

Classifications

Current U.S. Class: Headphone Or Headset (D14/205)
International Classification: 1401;