Tool for dispensing adhesives, sealants, and underfill materials
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Description
FIG. 1 is an elevational view of a first end for the new design for a tool for dispensing adhesives, sealants, and underfill material;
FIG. 2 is a top plan view of the tool as shown in FIG. 1;
FIG. 3 is a bottom view;
FIG. 4 is a right side elevational view wherein the left elevational view is a mirror image; and,
FIG. 5 is a rear elevational view.
Claims
The ornamental design for a tool for dispensing adhesives, sealants, and underfill materials, as shown and described.
Referenced Cited
Patent History
Patent number: D474214
Type: Grant
Filed: Jun 14, 2002
Date of Patent: May 6, 2003
Assignee: Nordson Corporation (Westlake, OH)
Inventors: Brett Huey (San Diego, CA), David N. Padgett (Carlsbad, CA)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firm: Raymond J. Slattery, III
Application Number: 29/162,410
Type: Grant
Filed: Jun 14, 2002
Date of Patent: May 6, 2003
Assignee: Nordson Corporation (Westlake, OH)
Inventors: Brett Huey (San Diego, CA), David N. Padgett (Carlsbad, CA)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firm: Raymond J. Slattery, III
Application Number: 29/162,410
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2)
International Classification: 1509;
International Classification: 1509;