Tool for dispensing adhesives, sealants, and underfill materials

- Nordson Corporation
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Description

FIG. 1 is an elevational view of a first end for the new design for a tool for dispensing adhesives, sealants, and underfill material;

FIG. 2 is a top plan view of the tool as shown in FIG. 1;

FIG. 3 is a bottom view;

FIG. 4 is a right side elevational view wherein the left elevational view is a mirror image; and,

FIG. 5 is a rear elevational view.

Claims

The ornamental design for a tool for dispensing adhesives, sealants, and underfill materials, as shown and described.

Referenced Cited
U.S. Patent Documents
D365830 January 2, 1996 Hubbard et al.
D429263 August 8, 2000 Auber et al.
D466140 November 26, 2002 Huey
Patent History
Patent number: D474214
Type: Grant
Filed: Jun 14, 2002
Date of Patent: May 6, 2003
Assignee: Nordson Corporation (Westlake, OH)
Inventors: Brett Huey (San Diego, CA), David N. Padgett (Carlsbad, CA)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firm: Raymond J. Slattery, III
Application Number: 29/162,410
Classifications
Current U.S. Class: Solid Material Melting, E.g., Solder, Etc. (D15/144.2)
International Classification: 1509;