CPU board assembly panel
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Description
FIG. 1 is a bottom view thereof;
FIG. 2 is a top view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a left side elevational view thereof; and,
FIG. 5 is a right side elevational view thereof.
The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for CPU board assembly panel, as shown and described.
Referenced Cited
Patent History
Patent number: D477605
Type: Grant
Filed: Mar 21, 2001
Date of Patent: Jul 22, 2003
Assignee: Sun Microsystems, Inc. (Palo Alto, CA)
Inventors: Christopher H. Frank (Campbell, CA), Robert F. Mori (Palo Alto, CA)
Primary Examiner: Freda Nunn
Attorney, Agent or Law Firm: O'Melveny & Myers LLP
Application Number: 29/138,911
Type: Grant
Filed: Mar 21, 2001
Date of Patent: Jul 22, 2003
Assignee: Sun Microsystems, Inc. (Palo Alto, CA)
Inventors: Christopher H. Frank (Campbell, CA), Robert F. Mori (Palo Alto, CA)
Primary Examiner: Freda Nunn
Attorney, Agent or Law Firm: O'Melveny & Myers LLP
Application Number: 29/138,911
Classifications