Electronics package

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front perspective view of the electronics package.

FIG. 2 is a left side elevation view of the electronics package depicted in FIG. 1.

FIG. 3 is right side elevation view of the electronics package depicted in FIG. 1.

FIG. 4 is a front elevation view of the electronics package depicted in FIG. 1.

FIG. 5 is a rear elevation view of the electronics package depicted in FIG. 1.

FIG. 6 is a top plan view of the electronics package depicted in FIG. 1; and,

FIG. 7 is a bottom plan view of the electronics package depicted in FIG. 1.

Claims

The ornamental design for an electronics package, as shown and described.

Referenced Cited
U.S. Patent Documents
D270460 September 6, 1983 Burtoff et al.
4512567 April 23, 1985 Phillips
5203563 April 20, 1993 Loper, III
5317336 May 31, 1994 Hall
D399884 October 20, 1998 Schultz et al.
5829745 November 3, 1998 Houle
D410970 June 15, 1999 Larian
6092705 July 25, 2000 Meritt
D432585 October 24, 2000 Okabe
D433075 October 31, 2000 Larian
D435603 December 26, 2000 Holmes et al.
6461238 October 8, 2002 Rehkemper et al.
Patent History
Patent number: D484546
Type: Grant
Filed: Jan 10, 2003
Date of Patent: Dec 30, 2003
Assignee: Tek Nek Toys International, Inc. (Mokena, IL)
Inventor: Jack Horchler (Mokena, IL)
Primary Examiner: Prabhakar Deshmukh
Attorney, Agent or Law Firm: Michael, Best & Friedrich LLC
Application Number: 29/174,053
Classifications
Current U.S. Class: Including Screen (D21/329); Electronic Type (D21/324)
International Classification: 2101;