Electronic device suspending structure assembly

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Description

FIG. 1 is a perspective view of an electronic device suspending structure assembly of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for an electronic device suspending structure assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
3822050 July 1974 Schurr
4886405 December 12, 1989 Blomberg
D340719 October 26, 1993 Yoder
D362253 September 12, 1995 Vogels
5796585 August 18, 1998 Sugiyama et al.
D441273 May 1, 2001 O'Donnell et al.
D449300 October 16, 2001 Bentz et al.
6520605 February 18, 2003 Nunokawa et al.
Patent History
Patent number: D511676
Type: Grant
Filed: Feb 12, 2004
Date of Patent: Nov 22, 2005
Assignee: Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien)
Inventors: Cheng Kuang Chung (Tu-Chen), Shin-Hua Wen (Tu-Chen)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Susan Moon Lee
Attorney: Wei Te Chung
Application Number: 29/199,441
Classifications
Current U.S. Class: D8/355