Housing for an electronic circuit module
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Description
The housing for an electronic circuit module is intended to be used to house electronic circuit board and their included electronic components and other electronic circuitry.
FIG. 1 is a right side perspective view of the housing for an electronic circuit module embodying our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a housing for an electronic circuit module, as shown and described.
Referenced Cited
Patent History
Patent number: D514075
Type: Grant
Filed: Dec 18, 2003
Date of Patent: Jan 31, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/195,849
Type: Grant
Filed: Dec 18, 2003
Date of Patent: Jan 31, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/195,849
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)