Housing for an electronic circuit module

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Description

The housing for an electronic circuit module is intended to be used to house electronic circuit board and their included electronic components and other electronic circuitry.

FIG. 1 is a right side perspective view of the housing for an electronic circuit module embodying our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a housing for an electronic circuit module, as shown and described.

Referenced Cited
U.S. Patent Documents
5842514 December 1, 1998 Zapach et al.
6625017 September 23, 2003 Lin et al.
6628521 September 30, 2003 Gustine et al.
6649830 November 18, 2003 Bartlett et al.
Patent History
Patent number: D514075
Type: Grant
Filed: Dec 18, 2003
Date of Patent: Jan 31, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/195,849
Classifications
Current U.S. Class: Casing Or Enclosure Not Elsewhere Specified (D13/184)