Modular electronic housing

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Description

The Modular Electronic Housing Thereof includes modular electronic housings intended to be used to house electronic circuit board and their included electronic components. The modular housings can be assembled into groupings of electronic housings as illustrated.

FIG. 1 is a right side perspective view of a modular electronic housing showing our new design.

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a top plan view thereof; and,

FIG. 4 is a bottom plan view thereof.

The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a modular electronic housing, as shown and described.

Referenced Cited
U.S. Patent Documents
5842514 December 1, 1998 Zapach et al.
6625017 September 23, 2003 Lin et al.
6628521 September 30, 2003 Gustine et al.
6649830 November 18, 2003 Bartlett et al.
Patent History
Patent number: D518450
Type: Grant
Filed: Dec 18, 2003
Date of Patent: Apr 4, 2006
Assignee: Honeywell International, Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/195,922
Classifications
Current U.S. Class: Casing Or Enclosure Not Elsewhere Specified (D13/184)