Modular electronic housing and assemblies
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Description
The modular electronic housing and assemblies thereof comprise an assembly of modular electronic housings intended to be used to house electronic circuit boards and their included electronic components.
The FIGURE is a right side perspective view of a modular electronic housing and assemblies showing our new design.
The broken line disclosure in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a modular electronic housing and assemblies, as shown and described.
Referenced Cited
Patent History
Patent number: D519087
Type: Grant
Filed: Jun 28, 2005
Date of Patent: Apr 18, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/233,209
Type: Grant
Filed: Jun 28, 2005
Date of Patent: Apr 18, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/233,209
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)
