Modular electronic housing and assemblies
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Description
The modular electronic housing and assemblies comprises a modular electronic housing intended to be used to house electronic circuit boards and their included electronic components.
The FIGURE is a right side perspective view of a modular electronic housing and assemblies showing our new design.
The broken line disclosure in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a modular electronic housing and assemblies, as shown and described.
Referenced Cited
Patent History
Patent number: D519470
Type: Grant
Filed: Jun 28, 2005
Date of Patent: Apr 25, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/233,206
Type: Grant
Filed: Jun 28, 2005
Date of Patent: Apr 25, 2006
Assignee: Honeywell International Inc. (Morristown, NJ)
Inventors: Amand J. Hahn (Lansdale, PA), Rod P. Boer (Hartboro, PA), Eric A. Schneider (Erdenheim, PA)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Anthony Miologos
Application Number: 29/233,206
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)
