Earloop for a communications headset
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This application is related to co-pending U.S. Design patent application 29/212,885, filed Sep. 8, 2004, which is incorporated herein by reference in its entirety.
FIG. 1 is an upper front left perspective view of an earloop for a communications headset, the broken line drawings of a microphone boom of the communications headset in the drawings herein is for illustrative purposes only and forms no part of the claimed design.
FIG. 2 is a bottom plan view of the earloop of FIG. 1.
FIG. 3 is an upper rear right perspective view of the earloop of FIG. 1.
FIG. 4 is a right side elevational view of the earloop of FIG. 1.
FIG. 5 is a left side elevational view of the earloop of FIG. 1.
FIG. 6 is a front elevational view of the earloop of FIG. 1; and,
FIG. 7 is an upper rear left perspective view of the earloop of FIG. 1.
Claims
The ornamental design for an earloop for a communications headset, as shown and described.
Type: Grant
Filed: May 12, 2005
Date of Patent: May 23, 2006
Assignee: Plantronics, Inc. (Santa Cruz, CA)
Inventor: Soohyun Ham (Santa Cruz, CA)
Primary Examiner: Paula A. Greene
Application Number: 29/229,927
