Microphone boom for a communications headset
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This application is related to U.S. design patent application serial numbers (not yet known) both filed concurrently herewith.
FIG. 1 is an upper left front perspective view of a microphone boom for a communications headset showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The ornamental design that is claimed is shown in solid lines in the drawings. The broken line outline of a headset earpiece in the drawings is shown for environmental purposes only, and forms no part of the claimed design.
Claims
The ornamental design for a microphone boom for a communications headset, as shown and described.
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Type: Grant
Filed: Dec 19, 2005
Date of Patent: Jan 30, 2007
Assignee: Plantronics, Inc. (Santa Cruz, CA)
Inventors: Matt Bentley (Scotts Valley, CA), Gregor Magnusson (Aptos, CA), Soohyun Ham (Santa Cruz, CA)
Primary Examiner: Paula A. Greene
Application Number: 29/245,216
