Cordless soldering apparatus

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front perspective view of the cordless soldering apparatus thereof;

FIG. 2 is a rear perspective view of the cordless soldering apparatus thereof; and,

FIG. 3 is a top plan view of the cordless soldering apparatus thereof.

Claims

The ornamental design for the cordless soldering apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
2973422 February 1961 Smith
3141956 July 1964 Schoenwald
3234356 February 1966 Babb
3461874 August 1969 Martinez
3770937 November 1973 Smits
3899654 August 1975 Walton
4064447 December 20, 1977 Edgell et al.
4199096 April 22, 1980 Keefe et al.
4734559 March 29, 1988 Fortune et al.
4793541 December 27, 1988 Dravnieks
5064994 November 12, 1991 Urban
5117091 May 26, 1992 Ely
D442447 May 22, 2001 Fujiwara
D481278 October 28, 2003 Murillo
6797924 September 28, 2004 Axinte et al.
20020047001 April 25, 2002 Axinte et al.
20040016741 January 29, 2004 Evanyk
20040149713 August 5, 2004 Axinte et al.
20060011600 January 19, 2006 Miyazaki et al.
Patent History
Patent number: D536718
Type: Grant
Filed: Aug 4, 2005
Date of Patent: Feb 13, 2007
Inventor: Eric Murray (Auburn, NH)
Primary Examiner: Antoine D. Davis
Assistant Examiner: Patricia Palasik
Attorney: Pearson & Pearson, LLP.
Application Number: 29/235,699
Classifications
Current U.S. Class: Solid Material Melting, E.g., Solder, Etc. (D15/144.2)