CPU heat sink packaging box

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Description

FIG. 1 is a top plan view of a CPU heat sink packaging box showing our new design, in disassembled condition;

FIG. 2 is a top plan view thereof, in assembled condition;

FIG. 3 is a side elevational view thereof;

FIG. 4 is a side elevational view thereof from the side opposite that shown in FIG. 3;

FIG. 5 is an end elevational view thereof; and,

FIG. 6 is an end elevational view thereof from the end opposite that shown in FIG. 5.

The black shading in the drawing is intended to represent the color black in the claimed design.

Claims

The ornamental design for a CPU heat sink packaging box, as shown and described.

Referenced Cited
U.S. Patent Documents
D206771 January 1967 Valiulis
D257226 October 7, 1980 Kimball
D270617 September 20, 1983 Skowronski et al.
4742914 May 10, 1988 Klein
D429637 August 22, 2000 Kumakura et al.
Patent History
Patent number: D539640
Type: Grant
Filed: Oct 28, 2004
Date of Patent: Apr 3, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd (Taipei Hsien)
Inventors: Ming-Fang Liu (Shenzhen), Chun-Chi Liang (Tu-Chen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Derrick Holland
Attorney: Wei Te Chung
Application Number: 29/216,168
Classifications
Current U.S. Class: D9/415