CPU heat sink packaging box
Latest Hon Hai Precision Ind. Co., Ltd Patents:
Description
FIG. 1 is a top plan view of a CPU heat sink packaging box showing our new design, in disassembled condition;
FIG. 2 is a top plan view thereof, in assembled condition;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a side elevational view thereof from the side opposite that shown in FIG. 3;
FIG. 5 is an end elevational view thereof; and,
FIG. 6 is an end elevational view thereof from the end opposite that shown in FIG. 5.
The black shading in the drawing is intended to represent the color black in the claimed design.
Claims
The ornamental design for a CPU heat sink packaging box, as shown and described.
Referenced Cited
Patent History
Patent number: D539640
Type: Grant
Filed: Oct 28, 2004
Date of Patent: Apr 3, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd (Taipei Hsien)
Inventors: Ming-Fang Liu (Shenzhen), Chun-Chi Liang (Tu-Chen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Derrick Holland
Attorney: Wei Te Chung
Application Number: 29/216,168
Type: Grant
Filed: Oct 28, 2004
Date of Patent: Apr 3, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd (Taipei Hsien)
Inventors: Ming-Fang Liu (Shenzhen), Chun-Chi Liang (Tu-Chen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Derrick Holland
Attorney: Wei Te Chung
Application Number: 29/216,168
Classifications
Current U.S. Class:
D9/415