Computer motherboard packaging box

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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a perspective view of a computer motherboard packaging box of our new design;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a side elevational view thereof from the side opposite that shown in FIG. 2;

FIG. 4 is an end elevational view thereof;

FIG. 5 is an end elevational view thereof from the end opposite that shown in FIG. 4;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a computer motherboard packaging box, as shown and described.

Referenced Cited
U.S. Patent Documents
D382478 August 19, 1997 Park
D428335 July 18, 2000 Toyota et al.
D453002 January 22, 2002 Mansau
D453682 February 19, 2002 Kusumi et al.
D453683 February 19, 2002 Kusumi et al.
D482279 November 18, 2003 Waldburger et al.
Patent History
Patent number: D539645
Type: Grant
Filed: Nov 15, 2004
Date of Patent: Apr 3, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd (Taipei Hsien)
Inventors: Jing-Qun Chen (Shenzhen), Chun-Chi Liang (Tu-Chen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Mark Goodwin
Attorney: Wei Te Chung
Application Number: 29/217,197
Classifications
Current U.S. Class: D9/432