Computer motherboard packaging box
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The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
FIG. 1 is a perspective view of a computer motherboard packaging box of our new design;
FIG. 2 is a side elevational view thereof;
FIG. 3 is a side elevational view thereof from the side opposite that shown in FIG. 2;
FIG. 4 is an end elevational view thereof;
FIG. 5 is an end elevational view thereof from the end opposite that shown in FIG. 4;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims
The ornamental design for a computer motherboard packaging box, as shown and described.
Type: Grant
Filed: Nov 15, 2004
Date of Patent: Apr 3, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd (Taipei Hsien)
Inventors: Jing-Qun Chen (Shenzhen), Chun-Chi Liang (Tu-Chen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Mark Goodwin
Attorney: Wei Te Chung
Application Number: 29/217,197