Magnetic inductive sensor

- Hiwin Mikrosystem Corp.
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Description

FIG. 1 is a perspective view of a magnetic inductive sensor showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view to that shown.

Claims

The ornamental design for a magnetic inductive sensor, as shown and described.

Referenced Cited
U.S. Patent Documents
D531066 October 31, 2006 Watabe
20030090844 May 15, 2003 Shimizu et al.
20060272146 December 7, 2006 Seyama et al.
Patent History
Patent number: D565973
Type: Grant
Filed: May 29, 2007
Date of Patent: Apr 8, 2008
Assignee: Hiwin Mikrosystem Corp. (Taichung)
Inventors: Ming-Chih Huang (Taichung), Don-Hua Cheng (Taichung)
Primary Examiner: Antoine D. Davis
Attorney: Banger Shia
Application Number: 29/280,452