Headphone cork packaging block
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Description
Claims
The ornamental design for the headphone cork packaging block, as shown and described.
Referenced Cited
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Patent History
Patent number: D576486
Type: Grant
Filed: Oct 18, 2007
Date of Patent: Sep 9, 2008
Assignees: Sony Corporation (Tokyo), Sony Electronics Inc. (Park Ridge, NJ)
Inventor: Michelle Koza (Santa Monica, CA)
Primary Examiner: T. Chase Nelson
Assistant Examiner: Karen Acker
Attorney: John L. Rogitz
Application Number: 29/296,346
Type: Grant
Filed: Oct 18, 2007
Date of Patent: Sep 9, 2008
Assignees: Sony Corporation (Tokyo), Sony Electronics Inc. (Park Ridge, NJ)
Inventor: Michelle Koza (Santa Monica, CA)
Primary Examiner: T. Chase Nelson
Assistant Examiner: Karen Acker
Attorney: John L. Rogitz
Application Number: 29/296,346
Classifications
Current U.S. Class:
D9/432