Linear type light emitting diode assembly with heat dissipating module

- Edison Opto Corporation
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a linear type light emitting diode assembly with heat dissipating module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a bottom side elevational view thereof; and,

FIG. 7 is a top side elevational view thereof.

Claims

The ornamental design for a linear type light emitting diode assembly with heat dissipating module, as shown and described.

Referenced Cited
U.S. Patent Documents
D565515 April 1, 2008 Chen
D565753 April 1, 2008 Uemoto et al.
D566303 April 8, 2008 Uemoto et al.
D572387 July 1, 2008 Uemoto et al.
Patent History
Patent number: D582576
Type: Grant
Filed: Apr 3, 2008
Date of Patent: Dec 9, 2008
Assignee: Edison Opto Corporation (Taipei Hsien)
Inventors: Hung-Ta Liao (Taipei County), Pao-Shen Chen (Taipei County)
Primary Examiner: Marcus A. Jackson
Attorney: Rosenberg, Klein & Lee
Application Number: 29/306,153
Classifications
Current U.S. Class: Electric Light Bulb (34) (D26/2)