Interconnectable module for plastic floor with high base

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Description

FIG. 1 is a front view of an interconnectable module for plastic floor with high base showing our new design;

FIG. 2 is a bottom view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a back view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view thereof showing the interconnectable module for plastic floor base in use.

The broken lines depict two additional pieces of the interconnectable module for plastic floor base connected together to depict environmental use. None of the broken lines form any part of the claimed design.

Claims

The ornamental design for an interconnectable module for plastic floor with high base, as shown and described.

Referenced Cited
U.S. Patent Documents
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D356709 March 28, 1995 Scott
D358053 May 9, 1995 Austin
5640821 June 24, 1997 Koch
D400040 October 27, 1998 Pawson et al.
D404236 January 19, 1999 Bergwall et al.
6298624 October 9, 2001 Pacione
D479936 September 30, 2003 Nurmentaus
D484097 December 23, 2003 Drane et al.
D532238 November 21, 2006 Thrush
D543764 June 5, 2007 Thrush
D552909 October 16, 2007 McGrath et al.
D575092 August 19, 2008 Hillson
D575093 August 19, 2008 Hillson
Patent History
Patent number: D585687
Type: Grant
Filed: Jul 15, 2008
Date of Patent: Feb 3, 2009
Inventor: Ying-Kuang Lai (Dongguan, Guangdong)
Primary Examiner: Robert M Spear
Assistant Examiner: Barbara B Lohr
Attorney: Global IP Services
Application Number: 29/321,323
Classifications
Current U.S. Class: D6/582