Electronic signature pad

- StepOver GmbH
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Description

FIG. 1 is a perspective view of an electronic signature pad of the present invention;

FIG. 2 is a front elevational view of the electronic signature pad;

FIG. 3 is a back elevational view of the electronic signature pad;

FIG. 4 is a top plan view of the electronic signature pad;

FIG. 5 is a bottom plan view of the electronic signature pad;

FIG. 6 is a right side elevational view of the electronic signature pad; and,

FIG. 7 is a left side elevational view of the electronic signature pad.

The broken lines shown are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for an electronic signature pad, as shown and described.

Referenced Cited
U.S. Patent Documents
D307134 April 10, 1990 Makidera
5103486 April 7, 1992 Grippi
5375226 December 20, 1994 Sano et al.
6177926 January 23, 2001 Kunert
6757156 June 29, 2004 Adams et al.
D532009 November 14, 2006 Zank et al.
20020129257 September 12, 2002 Parmelee et al.
20030132918 July 17, 2003 Fitch et al.
Foreign Patent Documents
2 373 220 November 2000 CA
198 11 930 September 1999 DE
198 59 932 June 2000 DE
10 2006 000 859 July 2007 DE
Other references
  • http://www.interlinkelectronics.com/library/media/papers/pdf/ePad%20family%20Brochure%202006.pdf, Interlink Electronics, Inc., pp. 1-4, 2007, Camarillo, CA 93012.
  • http://www.topazsystems.com/products/specs/SigGemColor57.pdf, Topaz Systems, Inc., pp. 1-2, 2003-2006, Simi Valley, CA 93065.
  • http://www.topazsystems.com/products/index.htm, Electronic signature pad options, p. 1, 2003-2005, Simi Valley, CA 93065.
  • U.S. Appl. No. 11/964,293, filed Dec. 26, 2007, Guenther.
Patent History
Patent number: D586812
Type: Grant
Filed: Nov 7, 2007
Date of Patent: Feb 17, 2009
Assignee: StepOver GmbH (Stuttgart)
Inventor: Andreas Guenther (Stuttgart)
Primary Examiner: Freda S Nunn
Attorney: Simpson & Simpson, PLLC
Application Number: 29/293,029
Classifications