Wafer

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Description

FIG. 1 is a perspective view of a wafer embodying my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a side perspective view of a second embodiment of a wafer embodying my new design;

FIG. 9 is a front view thereof;

FIG. 10 is a rear view thereof;

FIG. 11 is a left side view thereof;

FIG. 12 is a right side view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines shown in the drawings are for the purpose of illustrating unclaimed portions of the wafer and form no part of the claimed design.

Claims

The ornamental design for a wafer, as shown and described.

Referenced Cited
U.S. Patent Documents
D51802 February 1918 Williams
1848120 March 1932 Fisher
D166561 April 1952 Peters
D172039 April 1954 Nathan
D180738 August 1957 Katz
D215248 September 1969 Viitanen
D589230 March 31, 2009 Samarut
D596826 July 28, 2009 Hosier
D597276 August 4, 2009 Hosier
D611226 March 9, 2010 Haigh
D613030 April 6, 2010 Baulier
20030087004 May 8, 2003 Kemeny
20040052909 March 18, 2004 Contento et al.
Foreign Patent Documents
001736513 July 2010 EM
DM/050194 November 1999 WO
DM/062285 November 2002 WO
Patent History
Patent number: D648507
Type: Grant
Filed: Jan 20, 2010
Date of Patent: Nov 15, 2011
Assignee: The Procter & Gamble Company (Cincinnati, OH)
Inventor: Jessica Lynn Haigh (Ypsilanti, MI)
Primary Examiner: Barbara Fox
Attorney: Alexandra S. Anoff
Application Number: 29/354,116
Classifications
Current U.S. Class: D1/128