Molded fingerprint sensor structure with indicia regions

- Authentec, Inc.
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Description

FIG. 1 is a perspective view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 2 is a left side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 3 is a front elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 4 is a back elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 5 is a bottom view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 6 is a top view of a fingerprint sensor chip with integrally molded bezels including indicia regions; and,

FIG. 7 is a right side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions.

The broken lines depict unclaimed environmental subject matter.

Claims

We claim the ornamental design for a molded fingerprint sensor structure with indicia regions, as shown and described.

Referenced Cited
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6980286 December 27, 2005 Feng
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7147153 December 12, 2006 Rowe et al.
Other references
  • Rowe, Robert K., “A Multispectral Sensor for Fingerprint Spoof Detection”, Sensors, vol. 22, No. 1, (Jan. 2005), pp. 2-4.
  • http://www.validityinc.com/post.aspx?id=147, “Validity Launches the First Customizable LED Fingerprint Sensor”, Jan. 8, 2009.
  • www.boschman.nl/technology/technology.htm.
Patent History
Patent number: D652332
Type: Grant
Filed: Mar 5, 2010
Date of Patent: Jan 17, 2012
Assignee: Authentec, Inc. (Melbourne, FL)
Inventors: Robert Henry Bond (Plano, TX), Alan Kramer (Berkeley, CA), Giovanni Gozzini (Berkeley, CA)
Primary Examiner: George D Kirschbaum
Attorney: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Application Number: 29/357,084
Classifications
Current U.S. Class: Security Or Signal Instrument Or Casing (D10/104.1)