Thermal pack
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Description
The bead fill-volume depicted in the drawings of the thermal pack is shown for example purposes only and is not intended to limit the scope of the invention with respect to any specific bead fill-volume amount.
Claims
The ornamental design for a thermal pack, as substantially shown and described.
Referenced Cited
U.S. Patent Documents
4316287 | February 23, 1982 | Rule |
D300645 | April 11, 1989 | Bowden |
D302213 | July 18, 1989 | Motazedi |
D327330 | June 23, 1992 | Noble |
D349018 | July 26, 1994 | Kaiser |
D363670 | October 31, 1995 | Sullivan |
D401317 | November 17, 1998 | Gillies |
D402147 | December 8, 1998 | Scarborough |
D410749 | June 8, 1999 | Podd |
5978962 | November 9, 1999 | Hamowy |
D431269 | September 26, 2000 | Soderstrom |
D442278 | May 15, 2001 | Rury |
D446927 | August 28, 2001 | Rothschild |
Patent History
Patent number: D660973
Type: Grant
Filed: Sep 29, 2011
Date of Patent: May 29, 2012
Assignee: TheraPearl, LLC (Jessup, MD)
Inventor: Daniel Jared Baumwald (Elkridge, MD)
Primary Examiner: David Muller
Attorney: Pequignot + Myers LLC
Application Number: 29/402,971
Type: Grant
Filed: Sep 29, 2011
Date of Patent: May 29, 2012
Assignee: TheraPearl, LLC (Jessup, MD)
Inventor: Daniel Jared Baumwald (Elkridge, MD)
Primary Examiner: David Muller
Attorney: Pequignot + Myers LLC
Application Number: 29/402,971
Classifications
Current U.S. Class:
Simulative (D24/208)