Communication device having multi-module assembly
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The cables in the
Claims
The ornamental design for a communication device having multi-module assembly, as shown and described.
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Type: Grant
Filed: Dec 24, 2012
Date of Patent: May 27, 2014
Assignee: Sercomm Corporation (Taipei)
Inventor: Yi-Fei Yu (New Taipei)
Primary Examiner: Bridget L Eland
Application Number: 29/440,635