Flip-cover for an electronic device
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Description
In one embodiment, the dimension for the flip-cover is approximately 105×139×2.5 mm.
In one embodiment, the flip-cover the flip-cover includes a metal connecting piece and a leather cover.
In one embodiment, the flip-cover the flip-cover includes a metal connecting piece with a thickness of 2.5 mm and a leather cover with a thickness of 2 mm.
Claims
The ornamental design for a flip-cover for an electronic device, as shown and described.
Referenced Cited
U.S. Patent Documents
D657354 | April 10, 2012 | Kim |
D658187 | April 24, 2012 | Diebel |
D658188 | April 24, 2012 | Diebel |
D671948 | December 4, 2012 | Akana et al. |
D674799 | January 22, 2013 | Kim |
D674800 | January 22, 2013 | Kim |
D682838 | May 21, 2013 | Akana et al. |
D685799 | July 9, 2013 | Canizares et al. |
D685800 | July 9, 2013 | Canizares et al. |
D685801 | July 9, 2013 | Canizares et al. |
D685802 | July 9, 2013 | Canizares et al. |
D689055 | September 3, 2013 | Snyder |
D690702 | October 1, 2013 | Chung |
D694741 | December 3, 2013 | Kim |
D695745 | December 17, 2013 | Kim |
20120085679 | April 12, 2012 | Kim et al. |
20120322518 | December 20, 2012 | Kim |
Patent History
Patent number: D705783
Type: Grant
Filed: Dec 21, 2012
Date of Patent: May 27, 2014
Assignee: Huizhou TCL Mobile Communication Co., Ltd (Huizhou)
Inventor: Jie Weng (Huizhou)
Primary Examiner: Deanna L Pratt
Assistant Examiner: Lilyana Bekic
Application Number: 29/440,414
Type: Grant
Filed: Dec 21, 2012
Date of Patent: May 27, 2014
Assignee: Huizhou TCL Mobile Communication Co., Ltd (Huizhou)
Inventor: Jie Weng (Huizhou)
Primary Examiner: Deanna L Pratt
Assistant Examiner: Lilyana Bekic
Application Number: 29/440,414
Classifications
Current U.S. Class:
Cover (D14/440)