Flip-cover for an electronic device

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Description

FIG. 1 is a perspective view of flip-cover for an electronic device in accordance with the present invention

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a rear view of FIG. 1;

FIG. 4 is a top view of FIG. 1;

FIG. 5 is a bottom view of FIG. 1;

FIG. 6 is a left side view of FIG. 1; and,

FIG. 7 is a right side view of FIG. 1.

In one embodiment, the dimension for the flip-cover is approximately 105×139×2.5 mm.

In one embodiment, the flip-cover the flip-cover includes a metal connecting piece and a leather cover.

In one embodiment, the flip-cover the flip-cover includes a metal connecting piece with a thickness of 2.5 mm and a leather cover with a thickness of 2 mm.

Claims

The ornamental design for a flip-cover for an electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D657354 April 10, 2012 Kim
D658187 April 24, 2012 Diebel
D658188 April 24, 2012 Diebel
D671948 December 4, 2012 Akana et al.
D674799 January 22, 2013 Kim
D674800 January 22, 2013 Kim
D682838 May 21, 2013 Akana et al.
D685799 July 9, 2013 Canizares et al.
D685800 July 9, 2013 Canizares et al.
D685801 July 9, 2013 Canizares et al.
D685802 July 9, 2013 Canizares et al.
D689055 September 3, 2013 Snyder
D690702 October 1, 2013 Chung
D694741 December 3, 2013 Kim
D695745 December 17, 2013 Kim
20120085679 April 12, 2012 Kim et al.
20120322518 December 20, 2012 Kim
Patent History
Patent number: D705783
Type: Grant
Filed: Dec 21, 2012
Date of Patent: May 27, 2014
Assignee: Huizhou TCL Mobile Communication Co., Ltd (Huizhou)
Inventor: Jie Weng (Huizhou)
Primary Examiner: Deanna L Pratt
Assistant Examiner: Lilyana Bekic
Application Number: 29/440,414
Classifications
Current U.S. Class: Cover (D14/440)