Bump pad
Description
Claims
The ornamental design for a bump pad, as shown and described.
Referenced Cited
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Patent History
Patent number: D707059
Type: Grant
Filed: Apr 24, 2012
Date of Patent: Jun 17, 2014
Inventors: Ming Hsiung Huang (Taichung), Wei Chen Wang (Taichung)
Primary Examiner: Phillip S Hyder
Application Number: 29/418,934
Type: Grant
Filed: Apr 24, 2012
Date of Patent: Jun 17, 2014
Inventors: Ming Hsiung Huang (Taichung), Wei Chen Wang (Taichung)
Primary Examiner: Phillip S Hyder
Application Number: 29/418,934
Classifications
Current U.S. Class:
D6/601;
Exercise Equipment (D21/662)